T2 Copper Plate Custom Processing Copper Sheet Copper Strip Pure Red Copper Conductive Copper Plate

Copper plate has good mechanical properties, with excellent plasticity in the hot state and acceptable plasticity in the cold state. It offers good machinability, is easy to braze and weld, and is corrosion-resistant, though it is prone to stress corrosion cracking. Additionally, it is inexpensive and widely used as a common type of copper.
Mechanical properties: Tensile strength: ≥315
Elongation: ≥30
Note: Room temperature tensile mechanical properties for plates other than those used for locks and clocks.
Sample size: Diameter >2.0~4.0
Heat treatment specifications: Hot working temperature 650~850°C; Annealing temperature 600~700°C; Low-temperature annealing temperature for stress relief 270~300°C.
Copper has the second highest electrical and thermal conductivity after silver and is widely used in the production of conductive and thermal conductive equipment. It exhibits good corrosion resistance in atmospheres, seawater, certain non-oxidizing acids (hydrochloric acid, dilute sulfuric acid), alkalis, salt solutions, and various organic acids (acetic acid, citric acid), making it suitable for the chemical industry. Furthermore, copper has good weldability and can be processed through cold and hot plastic deformation into various semi-finished and finished products. In the 1970s, copper production surpassed the total production of all other types of copper alloys.
Copper is a relatively pure form of copper, often considered nearly pure, with good electrical conductivity and plasticity, though its strength and hardness are somewhat lower. It possesses excellent thermal conductivity, ductility, and corrosion resistance. Trace impurities in copper significantly affect its electrical and thermal conductivity. Elements such as titanium, phosphorus, iron, and silicon notably reduce electrical conductivity, while cadmium and zinc have minimal impact. Sulfur, selenium, and tellurium have very low solubility in copper and can form brittle compounds, which have little effect on conductivity but reduce processing plasticity.